The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Oct. 02, 2023
Meta Platforms Technologies, Llc, Menlo Park, CA (US);
Cameron Elliot Glasscock, Redmond, WA (US);
Zhenzhen Shen, Kirkland, WA (US);
Felippe Jose Pavinatto, Lynnwood, WA (US);
Omar Awartani, Redmond, WA (US);
Allison Tuuri, Seattle, WA (US);
Lichuan Chen, Kirkland, WA (US);
Aleksey Reiderman, Erie, CO (US);
Marcos Antonio Santana Andrade, Jr., Seattle, WA (US);
Meta Platforms Technologies, LLC, Menlo Park, CA (US);
Abstract
The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.