The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Feb. 23, 2024
Applicant:

Shenzhen Newsonic Technologies Co., Ltd., Shenzhen, CN;

Inventor:

Jian Wang, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 3/08 (2006.01); H03H 9/05 (2006.01); H03H 9/145 (2006.01);
U.S. Cl.
CPC ...
H03H 3/08 (2013.01); H03H 9/02661 (2013.01); H03H 9/02834 (2013.01); H03H 9/059 (2013.01); H03H 9/14538 (2013.01);
Abstract

A surface acoustic wave (SAW) device includes a substrate; an interdigital transducer (IDT) having lead-out portions and arrays of interdigital electrodes formed on the substrate, wherein the interdigital electrodes includes central portions, end portions, and intermediate portions between the end portions and the lead-out portions, and a thickness of the interdigital electrodes at the end portions is greater than a thickness of the interdigital electrodes at the central portions and the intermediate portions, thereby forming protruding structures at the end portions of the interdigital electrodes; a protective layer formed on the protruding structures at the end portions of the interdigital electrodes; a first temperature compensation layer formed on the protective layer; a second temperature compensation layer formed on the first temperature compensation layer and on the central portions and the intermediate portions of the interdigital electrodes; and a passivation layer formed on the second temperature compensation layer.


Find Patent Forward Citations

Wang, Jian. (2025). Surface acoustic wave device and fabrication method thereof (U.S. Patent No. 12476602). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12476602

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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