The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Apr. 14, 2021
Jcet Group Co., Ltd., Wuxi, CN;
Yaojian Lin, Wuxi, CN;
JCET GROUP CO., LTD., Wuxi, CN;
Abstract
The present invention discloses a fan-out package structure. The fan-out package structure includes: a redistribution layer, a solder ball disposed below the redistribution layer, a high-heat chip and a low-heat chip that are electrically connected above the redistribution layer, and a plastic package material disposed above the redistribution layer in a filling manner and coating the high-heat chip and the low-heat chip, wherein an upper surface of the high-heat chip is exposed outside the plastic package material, and an upper surface of the low-heat chip is encapsulated in the plastic package material; a warpage adjusting and protective layer is disposed on the upper surface of the low-heat chip, or at least one through hole is formed in the plastic package material right above the low-heat chip and part of the upper surface of the low-heat chip is exposed outside the plastic package material through the through hole.