The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Jan. 25, 2023
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/95 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/37638 (2013.01); H01L 2224/37655 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83054 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83395 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83463 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83948 (2013.01); H01L 2224/95053 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20106 (2013.01);
Abstract
When a semiconductor unit is heated, a heater having a flat heating surface is used for performing heating in a state in which a lower surface of an insulated circuit board is placed on the heating surface. When the semiconductor unit is cooled, a cooler having a cooling surface including a pair of support portions is used for performing cooling in which a lower surface of a pair of outer regions of the insulated circuit board are respectively placed to be contact with the pair of support portions, and in which a central region between the pair of outer regions of the insulated circuit board is pressed downward so as to be downward convex.