The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Dec. 23, 2019
Applicant:

Soitec, Bernin, FR;

Inventors:

Yvan Morandini, La Trinite, FR;

Walter Schwarzenbach, Saint Nazaire les Eymes, FR;

Frédéric Allibert, Grenoble, FR;

Eric Desbonnets, Lumbin, FR;

Bich-Yen Nguyen, Austin, TX (US);

Assignee:

Soitec, Bernin, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 21/322 (2006.01); H10D 62/10 (2025.01); H10D 87/00 (2025.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); H01L 21/0262 (2013.01); H01L 21/3226 (2013.01); H01L 21/76281 (2013.01); H10D 62/115 (2025.01); H10D 87/00 (2025.01);
Abstract

The present disclosure relates to a multilayer semiconductor-on-insulator structure, comprising, successively from a rear face toward a front face of the structure: a semiconductor carrier substrate with high electrical resistivity, whose electrical resistivity is between 500 Ω·cm and 30 kΩ·cm, a first electrically insulating layer, an intermediate layer, a second electrically insulating layer, which has a thickness less than that of the first electrically insulating layer, an active semiconductor layer, the multilayer structure comprises: at least one FD-SOI region, in which the intermediate layer is an intermediate first semiconductor layer, at least one RF-SOI region, adjacent to the FD-SOI region, in which the intermediate layer is a third electrically insulating layer, the RF-SOI region comprising at least one radiofrequency component plumb with the third electrically insulating layer.


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