The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Jan. 13, 2023
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Takaaki Sato, Tokyo, JP;

Akihiro Masuda, Tokyo, JP;

Shinya Ito, Tokyo, JP;

Norihisa Ando, Tokyo, JP;

Hideki Kaneko, Tokyo, JP;

Ken Aburakawa, Tokyo, JP;

Kenya Tamaki, Tokyo, JP;

Akitoshi Yoshii, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/224 (2006.01); H01G 2/10 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 2/106 (2013.01); H01G 4/12 (2013.01);
Abstract

An electronic component including a case including an accommodation part having an opening; a ceramic element arranged in the accommodation part; a metal terminal including an electrode connecting part connecting to the ceramic element, a mounting part exposed out of the accommodation part, and a terminal arm part connecting the electrode connecting part and the mounting part; a case cover including a closing plate part covering the opening, and a case cover lateral side portion extending in a depth direction of the accommodation part from a circumference of the closing plate part and at least partially facing against an accommodation side wall of the accommodation part; and a mold resin filling the accommodation part.


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