The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Dec. 30, 2024
Applicants:

China Automotive Technology and Research Center Co., Ltd., Tianjin, CN;

China Automotive Chip (Shenzhen) Technology Co., Ltd., Shenzhen, CN;

Inventors:

Xianzhao Xia, Tianjin, CN;

Ruiqing Zhai, Tianjin, CN;

Yujia Li, Tianjin, CN;

Rui Zhao, Tianjin, CN;

Mingyang Li, Tianjin, CN;

Mingkai Yan, Tianjin, CN;

Changqing Dong, Tianjin, CN;

Hui Rong, Tianjin, CN;

Lixiong Zhang, Tianjin, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 11/26 (2006.01); G06F 11/277 (2006.01);
U.S. Cl.
CPC ...
G06F 11/261 (2013.01); G06F 11/277 (2013.01);
Abstract

Disclosed in the present application is a high-spatial-accuracy electromagnetic fault injection method for a cryptographic chip. According to the method, a spatial position of an electromagnetic probe is adjusted according to a physical structure of a target chip and the characteristic of an integrated circuit, including accurate positioning of three dimensions of X, Y and Z as well as an angle with a surface of the chip, so that electromagnetic fault injection acts on a key area of the chip more accurately, thereby improving the pertinence and efficiency of fault injection.


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