The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Dec. 30, 2024
Applicants:

China Automotive Technology and Research Center Co., Ltd., Tianjin, CN;

China Automotive Chip (Shenzhen) Technology Co., Ltd., Shenzhen, CN;

Inventors:

Xianzhao Xia, Tianjin, CN;

Yuning Li, Tianjin, CN;

Mingyang Li, Tianjin, CN;

Yujia Li, Tianjin, CN;

Yaozong Xu, Tianjin, CN;

Rui Zhao, Tianjin, CN;

Ruiqing Zhai, Tianjin, CN;

Mingkai Yan, Tianjin, CN;

Changqing Dong, Tianjin, CN;

Hui Rong, Tianjin, CN;

Lixiong Zhang, Tianjin, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 11/26 (2006.01); G06F 11/277 (2006.01);
U.S. Cl.
CPC ...
G06F 11/261 (2013.01); G06F 11/277 (2013.01);
Abstract

Disclosed in the present application are a high-temporal-accuracy power glitch fault injection method and apparatus for a cryptographic chip. According to the method, power glitch fault injection time is adjusted by considering rise time of a power glitch fault, so that the power glitch fault injection time is controlled more accurately, the limitation of the power glitch fault injection in temporal accuracy is reduced, and the success rate of the power glitch fault injection is increased.


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