The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Sep. 11, 2023
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Terrence Huat Hin Tan, Bayan Lepas, MY;
Charles Walter Boecker, Ames, IA (US);
Ravi Shivnaraine, Pickering, CA;
Edwin Magtoto Gozun, Folsom, CA (US);
Sokratis Vamvakos, Sunnyvale, CA (US);
Microsoft Technology Licensing, LLC, Redmond, WA (US);
Abstract
Systems and methods for isolating faults in die-to-die interconnects are provided. A method includes providing a first transmission path, along a die-to-die interconnect, from a transmitter associated with a first die to an asynchronous buffer associated with a second die. The method further includes providing a second transmission path from voltage reference circuitry associated with the second die to the asynchronous buffer associated with the second die. The method further includes simultaneously enabling both the first transmission path and the second transmission path to allow the asynchronous buffer to receive inputs from both the transmitter associated with the first die and the voltage reference circuitry associated with the second die, such that the inputs received by the asynchronous buffer are indicative of: (1) no failure in the die-to-die interconnect, (2) an open failure in the die-to-die interconnect, or (3) a short failure in the die-to-die interconnect.