The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Apr. 21, 2022
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Taizo Asano, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01K 7/01 (2006.01); G05F 1/46 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01K 7/01 (2013.01); H01L 22/14 (2013.01); H01L 22/32 (2013.01); G01K 7/015 (2013.01); G05F 1/46 (2013.01); G05F 1/462 (2013.01);
Abstract

A semiconductor module with temperature characteristics adjustable through a measurement device. The semiconductor module includes a mounting board having a semiconductor chip and an integrated circuit mounted thereon. The semiconductor chip includes a switching device and a diode for temperature detection, a forward voltage of the diode being measurable by the measurement device. The integrated circuit includes a correction circuit that generates a corrected reference voltage, and a control circuit that receives the corrected reference voltage and a drive signal, and controls the switching device based on the corrected reference voltage and the drive signal. The mounting board includes a pad to be coupled to the diode with a wire. The pad has an area larger than a sum of a first area to be coupled to the wire and a second area to be in contact with the probe of the measurement device for measuring the forward voltage.


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