The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Nov. 18, 2019
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Tomohiro Kanazawa, Osaka, JP;
Yoshihiro Iguchi, Osaka, JP;
Naoki Kohyama, Osaka, JP;
Atsushi Shimada, Osaka, JP;
Kenshi Tsuji, Osaka, JP;
Yui Nakai, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 27/04 (2006.01); B21C 1/00 (2006.01); B21C 9/00 (2006.01); C22F 1/18 (2006.01);
U.S. Cl.
CPC ...
C22C 27/04 (2013.01); B21C 1/003 (2013.01); B21C 9/00 (2013.01); C22F 1/18 (2013.01); C22C 2200/04 (2013.01);
Abstract
A tungsten wire contains tungsten or a tungsten alloy. An average width of surface crystal grains in a direction perpendicular to an axis of the tungsten wire is at most 76 nm. The tungsten wire has a tensile of at least 4800 MPa, and a diameter of at most 100 μm.
Kanazawa, Tomohiro. (2025). Tungsten wire and saw wire (U.S. Patent No. 12473614). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12473614
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile