The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Jun. 09, 2022
Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventors:

Masashi Ikeda, Tokyo, JP;

Seiji Takagi, Tokyo, JP;

Toru Seo, Tokyo, JP;

Jun Matsui, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); B32B 7/027 (2019.01); B32B 7/12 (2006.01); B32B 15/01 (2006.01); B32B 37/12 (2006.01); C09J 7/21 (2018.01); C09J 7/35 (2018.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); B32B 7/027 (2019.01); B32B 7/12 (2013.01); B32B 15/012 (2013.01); B32B 37/1207 (2013.01); C09J 7/21 (2018.01); C09J 7/35 (2018.01);
Abstract

A laminate produced by laminating a plurality of materials having different linear expansion coefficients via an adhesive agent and is less liable to warp after the adhesive agent is heat-cured. The laminate has a structure including a first material, an adhesive agent layer, and a second material. The first material and the second material have different linear expansion coefficients, and the adhesive agent layer contains an adhesive agent having a warpage reduction index of not less than 30 as calculated from the following expression (1):Warpage reduction index=100−()×100  (1).


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