The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Jun. 12, 2020
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Takeshi Kiyohara, Osaka, JP;

Shigekazu Saito, Osaka, JP;

Takanori Okuda, Osaka, JP;

Assignee:

HENKEL AG & CO. KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 65/38 (2006.01); B65B 3/04 (2006.01); B65B 25/06 (2006.01); B65B 63/08 (2006.01); C08L 23/06 (2006.01); C09J 5/06 (2006.01); C09J 7/24 (2018.01); C09J 9/00 (2006.01);
U.S. Cl.
CPC ...
B65D 65/38 (2013.01); B65B 3/04 (2013.01); B65B 63/08 (2013.01); C08L 23/06 (2013.01); C09J 5/06 (2013.01); C09J 7/241 (2018.01); C09J 7/245 (2018.01); C09J 9/00 (2013.01); B65B 25/06 (2013.01); C08L 2203/16 (2013.01); C08L 2205/02 (2013.01); C08L 2205/025 (2013.01); C08L 2207/06 (2013.01); C08L 2314/02 (2013.01); C08L 2314/06 (2013.01);
Abstract

Disclosed is a film-wrapped type hot melt adhesive, comprising: a film made from a thermoplastic resin composition and a hot melt adhesive wrapped by the film, wherein the thermoplastic resin composition comprises an ethylene homopolymer, and a concavo-convex is formed on a surface of the film. The film-wrapped type hot melt adhesive has blocking resistance and thermal stability which are improved in a balanced manner.


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