The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Sep. 30, 2020
Applicant:

Toyobo Co., Ltd., Osaka, JP;

Inventors:

Naoki Watanabe, Otsu, JP;

Harumi Yonemushi, Otsu, JP;

Kousuke Sasai, Otsu, JP;

Hiroyuki Wakui, Otsu, JP;

Assignee:

TOYOBO CO., LTD., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/28 (2006.01); B32B 7/06 (2019.01); B32B 17/10 (2006.01);
U.S. Cl.
CPC ...
B32B 27/281 (2013.01); B32B 7/06 (2013.01); B32B 17/10 (2013.01); B32B 2307/412 (2013.01); B32B 2457/14 (2013.01);
Abstract

The purpose is to provide a laminate useful as a temporary support for producing a large-area, high-definition flexible electronic device, the laminate having stably low adhesive strength between a colorless and highly transparent polyimide film and an inorganic substrate even in the case of a large surface area and having few blister defects. The laminate that attains the purpose is obtained by initially wetting either one of an inorganic substrate coated with the silane coupling agent and a colorless polyimide film with an aqueous medium, and then laminating while pressing out the aqueous medium.


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