The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Apr. 24, 2023
Seiko Epson Corporation, Tokyo, JP;
Riona Toda, Shiojiri, JP;
Kenta Anegawa, Matsumoto, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A three-dimensional molding device includes: a stage; an ejection unit including a tip end portion in which a first nozzle hole and a second nozzle hole are formed adjacent to each other at a predetermined interval along a first axis, and configured to eject a material from the first nozzle hole and the second nozzle hole toward the stage; a position changing unit configured to change relative positions of the stage and the ejection unit along a second axis that is parallel to a deposition surface and that is orthogonal to the first axis; and a pressing unit disposed on a rear side in a movement direction of the ejection unit relative to the stage and configured to press the material deposited on the stage. The pressing unit presses a first deposition portion formed by the material that is ejected from the first nozzle hole and deposited, and a second deposition portion formed by the material that is ejected from the second nozzle hole and deposited at an interval from the first deposition portion, so as to couple the first deposition portion and the second deposition portion.