The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Mar. 10, 2023
Applicant:

Enjet Co. Ltd., Suwon-si, KR;

Inventors:

Do Young Byun, Seoul, KR;

Vu Dat Nguyen, Suwon-si, KR;

Hyung Dong Lee, Suwon-si, KR;

Assignee:

Enjet Co. Ltd., Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/112 (2017.01); B29C 64/188 (2017.01); B29C 64/209 (2017.01); B29C 64/245 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/112 (2017.08); B29C 64/188 (2017.08); B29C 64/209 (2017.08); B29C 64/245 (2017.08); B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 10/00 (2014.12);
Abstract

The invention relates to an additive manufacturing system and additive manufacturing method comprising a printing platform that sprays a droplet and that deposits the droplet on a substrate or a build platform by attractive-force control of an electric field to form at least one layer of a laminated body in a layer by layer method; a flattening unit that flattens the laminated body formed by the printing platform to a preset height; a curing unit that cures the laminated body flattened by the flattening unit; and a controller that controls the printing platform, the flattening unit and the curing unit.


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