The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Jul. 13, 2023
Hickory Springs Manufacturing Company, Hickory, NC (US);
David Murphy, High Point, NC (US);
Michael Heyn, Hickory, NC (US);
Alex Wesley, Huntersville, NC (US);
HICKORY SPRINGS MANUFACTURING COMPANY, Hickory, NC (US);
Abstract
A method for molding a seamless rebonded foam article with an internal cavity is provided. The method may include moving a middle mold to a middle mold form position within the mold cavity to press into a first portion of rebond foam particles, and moving a top mold to a top mold form position within the mold cavity to press into the second portion of rebond foam particles. The method may further include injecting steam into the mold cavity at a middle mold fluid port interface of the middle mold such that the steam passes into the mold cavity to interact with the first and second portions of rebond foam particles via at least one middle mold flow hole in the middle mold, and evacuating the steam via a vacuum source coupled to the top mold and the bottom mold.