The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Sep. 30, 2020
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

George Edward Berkey, Pine City, NY (US);

Alexander Lee Cuno, Sayre, PA (US);

John Walter Grunden, Lawrenceville, PA (US);

Kyler Robert Hurlburt, Horseheads, NY (US);

Yanxia Ann Lu, Sunnyvale, CA (US);

James Scott Sutherland, Painted Post, NY (US);

Oscar Walter Wheeler, Avon, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); C04B 35/645 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B01L 3/502715 (2013.01); C04B 35/6455 (2013.01); B01L 2200/12 (2013.01); B01L 2300/12 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/604 (2013.01);
Abstract

A module and a process for forming a monolithic substantially closed-porosity silicon carbide fluidic module having a tortuous fluid passage extending through the module, the tortuous fluid passage having an interior surface, the interior surface having a surface roughness in the range of from 0.1 to 10 μm Ra. The process includes positioning a positive fluid passage mold within a volume of silicon carbide powder, the powder coated with a binder; pressing the volume of silicon carbide powder with the mold inside to form a pressed body; heating the pressed body to remove the mold; and sintering the pressed body.


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