The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Aug. 31, 2021
Boe Technology Group Co., Ltd., Beijing, CN;
Ke Wang, Beijing, CN;
Zhanfeng Cao, Beijing, CN;
Xinhong Lu, Beijing, CN;
Qi Qi, Beijing, CN;
Yan Qu, Beijing, CN;
Zhiwei Liang, Beijing, CN;
Yingwei Liu, Beijing, CN;
Dapeng Xue, Beijing, CN;
Guoqiang Wang, Beijing, CN;
Jianguo Wang, Beijing, CN;
Song Liu, Beijing, CN;
Yongfei Li, Beijing, CN;
Ting Zeng, Beijing, CN;
Huan Liu, Beijing, CN;
Wanru Dong, Beijing, CN;
Heren Gui, Beijing, CN;
Jian Yang, Beijing, CN;
Haifeng Hu, Beijing, CN;
Yu Jiang, Beijing, CN;
Peng Xu, Beijing, CN;
Weiwei Chu, Beijing, CN;
Qi Gao, Beijing, CN;
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD., Beijing, CN;
Abstract
An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer. The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.