The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Mar. 24, 2020
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Ruth Boss, Neutraubling, DE;

Sebastian Wittmann, Regenstauf, DE;

Korbinian Perzlmaier, Regensburg, DE;

Frank Singer, Regenstauf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/24 (2010.01); A61B 5/00 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 33/00 (2010.01); H10H 20/01 (2025.01); H10H 20/812 (2025.01); H10H 20/821 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/821 (2025.01); A61B 5/6898 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H10H 20/018 (2025.01); H10H 20/812 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01); H10H 20/034 (2025.01); H10H 20/0364 (2025.01);
Abstract

The invention relates to a method for manufacturing modules with one or more optoelectronic components, comprising the steps: producing at least one layer stack providing a base module on a carrier having a first layer, an active layer formed thereon, and a second layer formed thereon; exposing a surface area of the first layer facing away from the carrier; forming a first contact to a surface region of the second layer facing away from the carrier; and forming a second contact to the surface area of the first layer facing away from the carrier.


Find Patent Forward Citations

Loading…