The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Oct. 25, 2022
Beihai Huike Photoelectrics Technology Co., Ltd., Beihai, CN;
Hkc Corporation Limited, Shenzhen, CN;
Song Sun, Beihai, CN;
Qin Xiong, Beihai, CN;
Jinsong Lu, Beihai, CN;
Je-Hao Hsu, Beihai, CN;
Haijiang Yuan, Beihai, CN;
BEIHAI HUIKE PHOTOELECTRICS TECHNOLOGY CO., LTD., Beihai, CN;
HKC CORPORATION LIMITED, Shenzhen, CN;
Abstract
A method of fabricating an array substrate and an array substrate are disclosed. The array substrate includes a bonding portion, the bonding portion being fabricated by: providing a substrate, and forming a metal layer on the substrate; sequentially depositing a first and a second insulating layer material on the metal layer; etching the first and second insulating layer material respectively at a first etching rate and a second etching rate to form a first insulating layer having a first via hole and a second insulating layer having a second via hole, respectively, thus obtaining a composite insulating layer of a double-layer structure; forming on the composite insulating layer an electrode layer connected to the metal layer through the first and second via holes to form the bonding portion; where the first etching rate and the second etching rate are different, and the first and second via holes are arranged correspondingly.