The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Apr. 27, 2021
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Jiwoong Kong, Hwaseong-si, KR;

Taehoon Noh, Suwon, KR;

Jung Ju Suh, Seocho-gu, KR;

Jinbae Kim, Ansan, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); C09J 7/30 (2018.01); C09J 9/00 (2006.01); C09J 11/04 (2006.01); C09J 163/00 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2023.01); C08K 3/02 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0083 (2013.01); C09J 7/30 (2018.01); C09J 9/00 (2013.01); C09J 11/04 (2013.01); C09J 163/00 (2013.01); H01L 23/552 (2013.01); H01L 25/0655 (2013.01); C08K 2003/023 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/0856 (2013.01); C08K 2201/01 (2013.01); C09J 2203/326 (2013.01); C09J 2463/00 (2013.01);
Abstract

A multilayer tape according to an embodiment of the present disclosure includes: an adhesive layer including an epoxy; and an electromagnetic interference (EMI) absorption layer disposed on the adhesive layer and including a thermoset epoxy resin and a plurality of magnetic metal particles which are distributed in the thermoset epoxy resin, and the magnetic metal particles include iron, and a ratio of a gross weight of the plurality of magnetic metal particles to a gross weight of the EMI absorption layer is higher than bout 40%, and a peel strength of the adhesive layer and the EMI absorption layer after the adhesive layer is cured is about 5 times or more greater than a peel strength of the adhesive layer and the EMI absorption layer before the adhesive layer is cured.


Find Patent Forward Citations

Loading…