The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Aug. 16, 2023
Applicant:
Htc Corporation, Taoyuan, TW;
Inventors:
Ta-Chun Pu, Taoyuan, TW;
Chun-Yih Wu, Taoyuan, TW;
Assignee:
HTC Corporation, Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01Q 1/27 (2006.01); H01Q 1/36 (2006.01); H01Q 1/44 (2006.01); H01Q 5/307 (2015.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01Q 1/273 (2013.01); H01Q 1/36 (2013.01); H01Q 1/44 (2013.01); H01Q 5/307 (2015.01);
Abstract
A heat dissipation device with a communication function includes a conductive substrate, a first conductive sidewall, a plurality of heat sink elements, and a feeding element. The first conductive sidewall and the heat sink elements are respectively coupled to the conductive substrate. The feeding element is coupled to a signal source. An antenna structure is formed by the feeding element, the conductive substrate, and at least one of the heat sink elements. A resonant path of the antenna structure is formed by at least one of the heat sink elements.