The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Feb. 20, 2025
Applicant:

Next Silicon Ltd., Givatayim, IL;

Inventor:

Yehuda Mizrahi, Kfar Yona, IL;

Assignee:

NEXT SILICON LTD., Givatayim, IL;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); H05K 1/0203 (2013.01); H05K 7/20254 (2013.01); H05K 7/2049 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10598 (2013.01);
Abstract

The present invention relates to the technological field of microelectronics and electronic engineering, specifically to advanced liquid-cooling-based thermal management systems for electronic components on printed circuit boards. The claimed invention represents a liquid cooling assembly and a computing device that provide an improvement to the technological field of microelectronics and electronic engineering. Specifically, the suggested solution is easily adjustable to mitigate mechanical tolerances between the different electrical components of the target PCB and adaptable to address the diverse thermal loads presented by them, while maintaining the compactness of the design. The suggested solution thereby increases the overall heat dissipation efficiency of thermal management systems.


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