The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Oct. 13, 2023
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Per Henrik Fremrot, Novato, CA (US);

Colin Montgomery, Mountain View, CA (US);

Maunish Shah, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05D 23/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20154 (2013.01); H05K 7/20209 (2013.01);
Abstract

A networking module cooling system includes a networking module connected to a networking device, and a temperature-based heat sink airflow channel adjustment system coupled to the networking module. The temperature-based heat sink airflow channel adjustment system includes a heat sink base, fixed heat sink fin subsystem(s) extending from the heat sink base and defining a first heat sink airflow sub-channel, and moveable heat sink fin subsystem(s) coupled to the heat sink base and defining a second heat sink airflow sub-channel adjacent the first heat sink airflow sub-channel. A heat-activated actuator subsystem coupled to the heat sink base is configured, in response to the heat sink base receiving heat generated by the networking module, to move the moveable heat sink fin subsystem(s) relative to the fixed heat sink fin subsystem(s) to adjust a size of a heat sink airflow channel provided by the first and second heat sink airflow sub-channels.


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