The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Nov. 01, 2021
Applicants:

Boe Mled Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Jing Wang, Beijing, CN;

Mingming Jia, Beijing, CN;

Lili Wang, Beijing, CN;

Sha Feng, Beijing, CN;

Chao Liu, Beijing, CN;

Ming Zhai, Beijing, CN;

Haiwei Sun, Beijing, CN;

Lingyun Shi, Beijing, CN;

Liqiang Wang, Beijing, CN;

Jingjing Zhang, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 1/118 (2013.01); H01L 25/0753 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/8313 (2013.01); H01L 2224/83201 (2013.01); H05K 2201/056 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A display module includes a display panel with a plurality of bonding electrodes arranged at intervals along a selected side edge of a non-display surface and divided into two bonding electrode groups, a first flexible circuit board and a second flexible circuit board. For the first flexible circuit board, each first conductive contact piece in a first wiring region is connected to a bonding electrode in a first bonding electrode group. For the second flexible circuit board, each second conductive contact piece in a second wiring region is connected to a bonding electrode in a second bonding electrode group. The first wiring region is closer to the selected side edge than the second wiring region in a first direction. The first fan-out region is spaced apart from the second wiring region in a second direction perpendicular to the first direction.


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