The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Jul. 30, 2023
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Sandor Farkas, Round Rock, TX (US);

Bhyrav Mutnury, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0298 (2013.01); H05K 3/0047 (2013.01); H05K 3/429 (2013.01); H05K 2201/096 (2013.01);
Abstract

A printed circuit board includes a dielectric material, a signal trace on a surface of the dielectric material, a signal layer within the dielectric material, a via including plating, and multiple back drill locations. The plating provides an electrical communication between the signal trace and the signal layer, and the via has a diameter. The back drill locations are along a length of the via beyond the signal layer. A first combined diameter of the back drill locations at a bottom of the back drill locations is equal to the dimeter of the via. A second combined diameter of the back drill locations at a top of the back drill locations is greater than the dimeter of the via.


Find Patent Forward Citations

Loading…