Electronic device comprising camera module with a multi-layer ceramic condenser (mlcc) disposed in a hole in a metal plate under a rigid printed circuit board (rpcb)

Abstract

A camera module according to an embodiment of the present disclosure may comprise: a rigid printed circuit board (RPCB), a metal plate coupled to the lower surface of the RPCB and having one or more holes formed therein, a multi-layer ceramic condenser (MLCC) disposed in the one or more holes in the RPCB, and an image sensor disposed on the metal plate. With reference to the lower surface of the RPCB, the MLCC may be formed to have a height less than the height of the metal plate. A camera module structure according to an embodiment of the present disclosure may comprise: a flexible printed circuit board (FPCB), an RPCB coupled to the lower surface of the FPCB and having one or more first holes formed therein, a metal plate coupled to the lower surface of the RPCB and having one or more second holes formed in areas corresponding to the first holes, respectively, an MLCC disposed in the first holes and the second holes below the FPCB, and an image sensor disposed on the metal plate. The MLCC may be disposed in at least one of spaces formed through the first holes and the second holes. According to various embodiments of the present disclosure, a different camera module structure may be utilized such that no separate space is necessary to mount a laminated ceramic capacitor, and space utilization may be improved.