The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Feb. 14, 2023
Murata Manufacturing Co., Ltd., Kyoto, JP;
Takanori Uejima, Kyoto, JP;
Hiromichi Kitajima, Kyoto, JP;
Naoya Matsumoto, Kyoto, JP;
Hisanori Murase, Kyoto, JP;
Nanami Yumura, Kyoto, JP;
Yoichi Sawada, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; a resin component that covers the first circuit component and the second circuit component; a metal shield layer that covers a surface of the resin component; a metal shield plate that is disposed over the major face and, with the module substrate seen in plan view, located between the first circuit component and the second circuit component; and a via-conductor disposed in the module substrate and set to a ground potential. The metal shield plate is in contact with the metal shield layer, and connected at the major face with the via-conductor. The metal shield plate has a thickness greater than a thickness of the metal shield layer and less than or equal to an outside diameter (of the via-conductor.