The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Aug. 02, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Hironori Fukuhara, Ibaraki, JP;

Rei Goto, Osaka, JP;

Keiichi Maki, Suita, JP;

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/25 (2006.01); H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/145 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/25 (2013.01); H03H 3/08 (2013.01); H03H 9/02574 (2013.01); H03H 9/1071 (2013.01); H03H 9/1092 (2013.01); H03H 9/145 (2013.01); H03H 9/64 (2013.01);
Abstract

A packaged surface acoustic wave device is disclosed. the packaged surface acoustic wave device can include a support substrate that includes a conductive via formed therein, a piezoelectric layer over the support substrate, an interdigital transducer electrode over the piezoelectric layer, a roof structure over the interdigital transducer electrode, and a conductive pillar directly over the conductive via. The conductive pillar supports the roof structure and defines at least a portion of a signal pathway between the interdigital transducer electrode and the conductive via.


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