The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Mar. 23, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Takumi Yasuda, Tokyo, JP;
Takahiro Mabuchi, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
Provided is a semiconductive tape in which semiconductive resin layers in which metal particles are dispersedly mixed are disposed on a fibrous insulation substrate, wherein the metal particles have a melting point higher than the curing temperature of the thermosetting resin to be subjected to an impregnation treatment and lower than the softening point of the fibrous insulation substrate. The semiconductive tape is used for the stator coil of a rotating electric machine to suppress erosion of the thermosetting resin, impairment of semiconductivity thereof, and the like caused by heat generation, discharges and the like during operation of the rotating electric machine, thus exhibiting corona resistance stably over an extended period of time.