The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Nov. 07, 2022
Applicant:

Korea Electronics Technology Institute, Seongnam-si, KR;

Inventors:

Jong Min Yook, Seongnam-si, KR;

Je In Yu, Seoul, KR;

Dong Su Kim, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/12 (2006.01); H01L 21/48 (2006.01); H01L 23/043 (2006.01); H01L 23/498 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/121 (2013.01); H01L 21/486 (2013.01); H01L 23/043 (2013.01); H01L 23/49827 (2013.01); H01P 11/002 (2013.01);
Abstract

A waveguide package and a method for manufacturing the same are disclosed. The waveguide package includes a package structure including a waveguide opened toward one side surface of a substrate, a semiconductor chip mounted on one surface of the package structure and configured to output an electrical signal to the waveguide. Since an interior of the waveguide is filled with air, electrical loss of the waveguide is minimized. The cavity is formed by processing the substrate made of photosensitive glass. Accordingly, the waveguide may be accurately formed. An electronic circuit may also be formed at the waveguide package. Accordingly, it may be possible to provide a waveguide package enhanced in degree of integration.


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