The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
May. 11, 2023
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yukiya Yamaguchi, Kyoto, JP;
Takanori Uejima, Kyoto, JP;
Motoji Tsuda, Kyoto, JP;
Yuji Takematsu, Kyoto, JP;
Shunji Yoshimi, Kyoto, JP;
Satoshi Arayashiki, Kyoto, JP;
Mitsunori Samata, Kyoto, JP;
Satoshi Goto, Kyoto, JP;
Yutaka Sasaki, Kyoto, JP;
Masayuki Aoike, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
An integrated circuit includes a first base that has at least a part formed of a first semiconductor material and that includes an electric circuit, a second base that has at least a part formed of a second semiconductor material having a thermal conductivity lower than the first semiconductor material and that includes a power amplifier circuit, and a high thermal conductive member that has at least a part formed of a high thermal conductive material having a thermal conductivity higher than the first semiconductor material and that is disposed between the electric circuit and the power amplifier circuit. At least a part of the high thermal conductive member overlaps at least a part of the first base and at least a part of the second base in plan view. The high thermal conductive member is in contact with the first base and the second base.