The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Sep. 02, 2022
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Takeyuki Suzuki, Kaga Ishikawa, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Toshiba Electronic Devices & Storage Corporation, Kawasaki, JP;
Abstract
A semiconductor device includes: a first connector including a first plate having a first upper surface and a first terminal connected to the first plate, a first plate including a second plate and a third plate, a plate thickness of the second plate being thinner than a plate thickness of the third plate, the third plate being provided between the second plate and the first terminal; a semiconductor chip provided on the first upper surface; a first bonding material provided between the first upper surface and the semiconductor chip; a second connector provided on the semiconductor chip, a third connector, the first plate being provided between the first terminal and the third connector; a second bonding material provided between the second connector and the semiconductor chip; and a third bonding material provided between the second connector and the third connector.