The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Jun. 19, 2019
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Yusuke Kaji, Tokyo, JP;

Aya Fujita, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/049 (2006.01); H01L 23/31 (2006.01); H01L 25/07 (2006.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 23/049 (2013.01); H01L 23/3107 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73265 (2013.01); H02P 27/08 (2013.01);
Abstract

The present invention provides a semiconductor device and a power converter having improved moisture resistance reliability. The semiconductor device of the present invention includes: a metal base substrate which includes a first insulating layer provided on a metal base, a support conductor provided on the first insulating layer, and a second insulating layer provided on a side surface of the support conductor; a semiconductor element bonded to the support conductor; a case provided outside the second insulating layer; an external terminal attached to the case; and a sealing member filled in a region surrounded by the support conductor, the second insulating layer and the case.


Find Patent Forward Citations

Loading…