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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12469794 B1

PDFFull Text
Date of Patent:
Nov. 11, 2025

Filed:

Sep. 22, 2022

Substrate having a metal layer comprising a marking

Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Atsushi Takano, Kadoma, JP;

Mitsuhiro Furukawa, Nishinomiya, JP;

Assignee:

SKYWORKS SOLUTIONS, INC., Irvine, CA (US);

Attorney:

Lando & Anastasi, LLP

Primary Examiner:

Caleen O Sullivan

Int. Cl.
CPC ...
H01L 23/544 (2006.01); B23K 26/06 (2014.01); B23K 101/40 (2006.01); B23K 103/12 (2006.01); H01L 21/027 (2006.01); H01L 21/3213 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); B23K 26/0661 (2013.01); H01L 21/0274 (2013.01); H01L 21/32139 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); B23K 2101/40 (2018.08); B23K 2103/12 (2018.08); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6677 (2013.01);
Abstract

A method of marking information on a substrate for use in a semiconductor component is provided. The method comprises providing a substrate for use in a semiconductor component, providing a metal layer on a surface of the substrate, and providing a marking within the metal layer. A method of making a die, a radio-frequency module and a wireless mobile device; as well as a substrate, a die, a radio-frequency module and a wireless mobile device is also provided.

Find Patent Forward Citations

Takano, Atsushi. (2025). Substrate having a metal layer comprising a marking (U.S. Patent No. 12469794). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12469794

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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