Die attach film die pad isolation for semiconductor devices

Abstract

In a described example, an apparatus includes: a semiconductor die having a device side surface and an opposing backside surface, the backside surface mounted to a die pad of a lead frame using a die attach film; bond pads overlying the device side surface of the semiconductor die; bond wires electrically coupling the bond pads to leads of the lead frame spaced from the die pad; and mold compound covering the semiconductor die, the bond wires, and portions of the lead frame, where portions of the leads are exposed from the mold compound to form terminals of the packaged semiconductor device. The die attach film has a partially cut die attach film layer with a cut side edge normal to the backside surface, and the die attach film has an uncut die attach film layer with a torn side edge normal to the backside surface.