The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Jul. 28, 2022
Infineon Technologies Ag, Neubiberg, DE;
Ajay Poonjal Pai, Unterhaching, DE;
Tao Hong, Soest, DE;
Adrian Lis, Regensburg, DE;
Oliver Markus Kreiter, Warstein, DE;
Matthias Rose, Kirchseeon, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A power semiconductor module includes: first and second substrates; at least one power semiconductor die arranged between and thermally coupled to a first side of each substrate, and electrically coupled to the first side of the first substrate; at least one rivet having a first end arranged on and electrically coupled to the first side of the first substrate; and an encapsulant encapsulating the at least one power semiconductor die, the at least one rivet and the substrates. At least parts of a second side of the substrates are exposed from the encapsulant. A second end of the at least one rivet is exposed at the encapsulant and configured to accept a press fit pin such that the at least one power semiconductor die can be electrically contacted from the outside.