The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

May. 10, 2021
Applicant:

Yamaha Robotics Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Munakata, Tokyo, JP;

Takuya Adachi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01N 21/95 (2006.01); G01N 29/22 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); G01N 21/9501 (2013.01); G01N 29/225 (2013.01); G06T 7/0004 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A defect detection device () which detects a defect of a semiconductor device () includes: a standing wave generator (), applying a standing wave () to the semiconductor device () to apply a suction force to a wire (); cameras (); and a control part (), adjusting an operation of a standing wave generator () and performing defect detection on the semiconductor device (). The control part () captures, by using the cameras (), a first image of the semiconductor device () of a first state in which the suction force is applied to the wire () and a second image of the semiconductor device () of a second state in which the suction force applied to the wire () is smaller than the first stage, and compares the first image and the second image to perform defect detection.


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