The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Apr. 08, 2024
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Kota Zenzai, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers, outer electrode layers on end surfaces of the multilayer body at opposite ends in a longitudinal direction and covering end surface sides of each of principal surfaces of the multilayer body at opposite ends in a laminating direction and end surface sides of each of side surfaces at opposite ends in a width direction and bumps on the end surface sides of one principal surface of the multilayer body such that the outer electrode layers covering the one principal surface are sandwiched between the bumps and the one principal surface. Each bump includes copper covering an area of about 50% or more and about 96% or less in a cross section through widthwise centers of the bumps and extending in the laminating direction and the longitudinal direction.


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