The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Mar. 04, 2022
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuya Ishima, Tokyo, JP;

Shinichi Kondo, Tokyo, JP;

Kosuke Ito, Tokyo, JP;

Shingo Hattori, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01F 41/043 (2013.01); G03F 7/0035 (2013.01); H01F 41/12 (2013.01);
Abstract

A method for manufacturing a multilayer coil componentincludes forming a plurality of insulator layers by a photolithography method using a photosensitive insulator paste, forming a plurality of conductors and via conductors by a photolithography method using a photosensitive conductive paste, a step of forming a first conductor, a step of forming a first insulator layer around the first conductor such that it becomes even with an upper surface of the first conductor, a step of forming a second insulator layer provided with a via hole on the first conductor and the first insulator layer, and a step of forming a second conductor connected to the first conductor via the via hole on the second insulator layer.


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