The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Apr. 27, 2022
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Tsung-Wei Wan, Hsinchu County, TW;

Wei-Ping Chen, New Taipei, TW;

Jau-Jan Deng, Taipei, TW;

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01); G02B 3/00 (2006.01); H10F 39/00 (2025.01); H10F 39/12 (2025.01);
U.S. Cl.
CPC ...
G06V 40/1318 (2022.01); G02B 3/0037 (2013.01); H10F 39/024 (2025.01); H10F 39/028 (2025.01); H10F 39/198 (2025.01); H10F 39/805 (2025.01); H10F 39/8057 (2025.01); H10F 39/8063 (2025.01);
Abstract

A fingerprint sensor has an array of microlenses formed on an upper surface of a transparent substrate; with a lower surface of the transparent substrate bonded to an upper surface of a fingerprint image sensor integrated circuit. In embodiments, it includes one or two filter layers on the lower surface of the transparent substrate, and may also include masked black baffle layers on one or more of the upper and lower surface of the transparent substrate. The sensor is made by forming the microlenses and black baffle layers on the transparent substrate, then aligning the transparent substrate to a wafer of fingerprint sensor integrated circuits and bonding the transparent substrate to the wafer, then dicing the wafer into individual fingerprint sensors.


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