Method for selective separation and transfer of two-dimensional material and method of fabricating device using the same

Abstract

A disclosed method of selective separation and transfer of 2D material may include preparing a substrate structure including an adhesion target layer in which at least two different material layers are arranged to be in contact with each other laterally, preparing a crystalline material member including a 2D material, wherein the 2D material constitutes a unit layer, and a plurality of the unit layers form a layered structure through bonding, adhering the crystalline material member to a surface of the adhesion target layer so that a bond is formed between the crystalline material member and the adhesion target layer, and separating the crystalline material member and the adhesion target layer so that a 2D material layer pattern separated from the crystalline material member is formed on the surface of the adhesion target layer.