The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Jan. 03, 2022
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Tatsuya Hayashi, Utsunomiya, JP;

Yosuke Murakami, Utsunomiya, JP;

Noriyasu Hasegawa, Utsunomiya, JP;

Hirotoshi Torii, Utsunomiya, JP;

Yusuke Tanaka, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B82Y 10/00 (2011.01); B29C 43/02 (2006.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 43/021 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

An imprint apparatus that forms a pattern of a resin on a substrate that includes a plurality of substrate-side pattern regions by using a mold. The imprint apparatus includes a first mechanism applying a force to the mold to thereby deform a mold-side pattern region of the mold, a second mechanism heating the substrate-side pattern region to generate an uneven temperature distribution within the substrate-side pattern region for deforming the substrate-side pattern region, and obtaining shape difference information between the mold-side pattern region and the substrate-side pattern region, to control a shape of the mold-side pattern region by using the first mechanism based on the obtained shape difference information and controlling such that an uneven temperature distribution is formed in the substrate-side pattern region by using the second mechanism based on the obtained shape difference information.


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