The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Aug. 03, 2022
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Wolfgang Schweiker, Weyarn, DE;

Simone Fontanesi, Villach, AT;

Simon Hainz, Villach, AT;

Manfred Schindler, Regensburg, DE;

Michael Weber, Mainburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 3/481 (2006.01); G01P 1/02 (2006.01); G01P 3/487 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/49 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
G01P 3/481 (2013.01); G01P 1/026 (2013.01); G01P 3/487 (2013.01); H01L 23/3107 (2013.01); H01L 23/49 (2013.01); H01L 23/495 (2013.01); H01L 23/562 (2013.01);
Abstract

A wheel sensor arrangement can include a first wheel speed sensor and a second wheel speed sensor. The first wheel speed sensor can include or be implemented with a first semiconductor die and can provide data regarding a speed of a rotating wheel. The second wheel speed sensor can also include or be implemented with a second semiconductor die and can provide data regarding the speed of the rotating wheel. The second semiconductor die can be galvanically isolated from the first semiconductor die. The wheel sensor arrangement can include a mold housing that forms around the first wheel speed sensor and the second wheel speed sensor. The mold housing can include a separation feature between the first sensor and the second sensor.


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