The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Sep. 08, 2020
Daikin Industries, Ltd., Osaka, JP;
Daikin Europe N.v., Ostend, BE;
Yuusuke Fujimoto, Osaka, JP;
Ryuuichi Toyota, Osaka, JP;
Kentaroh Taoka, Osaka, JP;
Atsushi Ohtani, Osaka, JP;
Kevin Cornelis, Ostend, BE;
David Steen, Ostend, BE;
DAIKIN INDUSTRIES, LTD., Osaka, JP;
DAIKIN EUROPE N.V., Ostend, BE;
Abstract
A heat pump device having a refrigerant circuit includes: a valve configured to maintain an opening degree during non-energization; a valve drive circuit configured to cause operation of the valve; a valve controller configured to control the valve drive circuit; and a power source circuit configured to supply a power source to the valve drive circuit. The power source circuit includes: a first power source circuit unit configured to receive power source supply from outside to generate a DC voltage; and a second power source circuit unit for backup. The second power source circuit unit receives power source supply from the outside to store power in a capacitor, and connects the capacitor in parallel to a first output electric path of the first power source circuit unit.