The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Oct. 05, 2021
Sumitomo Electric Hardmetal Corp., Hyogo, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Hirotsugu Iwasaki, Hyogo, JP;
Akihiko Ueda, Hyogo, JP;
Michiko Matsukawa, Hyogo, JP;
Satoru Kukino, Hyogo, JP;
Kei Hirai, Osaka, JP;
SUMITOMO ELECTRIC HARDMETAL CORP., Hyogo, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 μm and less than or equal to 50 μm, and a dislocation density of the diamond grains is more than or equal to 8.1×10mand less than 1.0×10m.