The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Oct. 10, 2023
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Yong Hoon Kwon, Suwon-si, KR;

Hyun Ji Lee, Gimhae-si, KR;

Jung Hyun Kim, Suwon-si, KR;

Tae Oh Kim, Hwaseong-si, KR;

So Mi Jung, Busan, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 27/04 (2006.01); H10K 50/842 (2023.01); H10K 59/80 (2023.01); H10K 71/00 (2023.01); H10K 59/131 (2023.01); H10K 77/10 (2023.01);
U.S. Cl.
CPC ...
C03C 27/044 (2013.01); H10K 50/8426 (2023.02); H10K 59/8722 (2023.02); H10K 71/00 (2023.02); H10K 59/131 (2023.02); H10K 77/10 (2023.02);
Abstract

A display device includes a display panel including a display area and a non-display area surrounding the display area, and a metal wiring layer disposed on at least a portion of the non-display area, an encapsulation substrate disposed on the display panel, a sealing member which is disposed between the display panel and the encapsulation substrate and bonds the display panel to the encapsulation substrate and a first fusion region provided in at least a partial region between the sealing member and the encapsulation substrate, where the first fusion region has no physical boundary, and where at least a portion of the sealing member is disposed on the metal wiring layer in the non-display area, and the first fusion region is separated from the metal wiring layer while overlapping the metal wiring layer in a thickness direction.


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