The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Nov. 17, 2021
Archem Inc., Tokyo, JP;
Akira Hashizume, Tokyo, JP;
Masaki Shinagawa, Tokyo, JP;
Archem Inc., Tokyo, JP;
Abstract
A seat pad () includes a surface portion () configured of a polyurethane foam (). In the surface portion (), wiring grooves () for wiring a wire harness () are formed. Each wiring groove () has a groove width W narrower than the diameter (ϕ) of the harness (), and a groove depth (D) deeper than the diameter ϕof the harness (). A seat pad manufacturing method uses, as a molding die, a molding die that has groove-forming protrusions to form the wiring grooves () and has holes formed in side surfaces of the groove-forming protrusions. A polyurethane foam material is supplied to an interior of the molding die, and when a molded product is removed from the molding die, molded portions formed in the holes are forcibly pulled out of the holes of the groove-forming protrusions.