The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Mar. 30, 2022
Applicant:

Hensoldt Sensors Gmbh, Taufkirchen, DE;

Inventors:

Jörg Sander, Ulm, DE;

Rolf Baltes, Munich, DE;

Andreas Salomon, Munich, DE;

Felix Zimmer, Erding, DE;

Tobias Hehn, Oberthulba, DE;

Assignee:

HENSOLDT Sensors GmbH, Taufkirchen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/194 (2017.01); B29C 64/393 (2017.01); H05K 1/02 (2006.01); B29L 31/34 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/194 (2017.08); B29C 64/393 (2017.08); H05K 1/0269 (2013.01); B29L 2031/3425 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12);
Abstract

A structure comprises: a plurality of substructures and a vernier-based position marker. The plurality of substructures include a first substructure, a second substructure, and at least one electronic component. The second substructure is at least partially additively manufactured on the first substructure. The vernier-based position marker is configured to indicate a relative offset between the first substructure and the second substructure.


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